SMTPlacementConstraints Properties

The SMTPlacementConstraints type exposes the following members.

Properties

	Name	Description
	MaximumComponentBodySizeX	The maximum body size in the X dimension that a component may be in order to be placed.
	MaximumComponentBodySizeY	The maximum body size in the Y dimension that a component may be in order to be placed.
	MaximumComponentHeight	The maximum height that a component may be in order to be placed.
	MaximumMountingPressure	The minimum amount of pressure that will be exerted on components during placement, expressed in kPa
	MinimumBGAPitch	The minimum ball pitch that a BGA type component must have in order to be placed.
	MinimumLeadWidth	The minimum lead width that a component must have in order to be placed.
	MinimumMountingPressure	The minimum amount of pressure that will be exerted on components during placement, expressed in kPa
	MinimumSOICPitch	The minimum lead pitch that an SOIC type component must have in order to be placed.
	MinumumComponentBodySizeX	The minimum body size in the X dimension that a component must be in order to be placed.
	MinumumComponentBodySizeY	The minimum body size in the Y dimension that a component must be in order to be placed.
	MinumumComponentHeight	The minimum height that a component must be in order to be placed.