SMTPlacement |
The SMTPlacementConstraints type exposes the following members.
Name | Description | |
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SMTPlacementConstraints |
Name | Description | |
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MaximumComponentBodySizeX | The maximum body size in the X dimension that a component may be in order to be placed. | |
MaximumComponentBodySizeY | The maximum body size in the Y dimension that a component may be in order to be placed. | |
MaximumComponentHeight | The maximum height that a component may be in order to be placed. | |
MaximumMountingPressure | The minimum amount of pressure that will be exerted on components during placement, expressed in kPa | |
MinimumBGAPitch | The minimum ball pitch that a BGA type component must have in order to be placed. | |
MinimumLeadWidth | The minimum lead width that a component must have in order to be placed. | |
MinimumMountingPressure | The minimum amount of pressure that will be exerted on components during placement, expressed in kPa | |
MinimumSOICPitch | The minimum lead pitch that an SOIC type component must have in order to be placed. | |
MinumumComponentBodySizeX | The minimum body size in the X dimension that a component must be in order to be placed. | |
MinumumComponentBodySizeY | The minimum body size in the Y dimension that a component must be in order to be placed. | |
MinumumComponentHeight | The minimum height that a component must be in order to be placed. |