SolderPasteMeasurement Properties

The SolderPasteMeasurement type exposes the following members.

Properties

	Name	Description
	A	The area of the paste deposition, expressed in square millimeters
	AR	Area Ratio of the related Aperture (Area/WallArea)
	DX	The x location of the center of the paste deposition relative to the center of the pad.
	DY	The y location of the center of the paste deposition relative to the center of the pad.
	EA	The expected area of the paste deposition, expressed in square millimeters
	EVol	The expected or nominal volume of the paste deposition, expressed in milliliters (ml)
	EX	The expected or nominal x dimension (length) required for this paste deposition, expressed in millimeters (mm).
	EY	The expected or nominal x dimension (length) required for this paste deposition, expressed in millimeters (mm).
	EZ	The expected or nominal height required for this paste deposition, expressed in millimeters (mm).
	Image	An optional image of the deposit formatted in an acceptable MIME image format (JPG, PNG, etc.)
	PX	The position X value in millimeters (mm).
	PY	The position X value in millimeters (mm).
	RXY	The counter-clockwise rotational offset on the X-Y plane (in degrees)
	Vol	The volume of the paste deposition, expressed in milliliters (ml)
	X	The x dimension (length) of the paste deposition, expressed in millimeters (mm).
	Y	The x dimension (length) of the paste deposition, expressed in millimeters (mm).
	Z	The height of the paste deposition, expressed in millimeters (mm).

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